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What is chaos engineering?

Dynatrace

Chaos engineering is a method of testing distributed software that deliberately introduces failure and faulty scenarios to verify its resilience in the face of random disruptions. Practitioners subject software to a controlled, simulated crisis to test for unstable behavior. Chaos engineers ask why. The history of chaos engineering.

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USENIX LISA2021 Computing Performance: On the Horizon

Brendan Gregg

AWS Graviton2); for memory with the arrival of DDR5 and High Bandwidth Memory (HBM) on-processor; for storage including new uses for 3D Xpoint as a 3D NAND accelerator; for networking with the rise of QUIC and eXpress Data Path (XDP); and so on. I also wrote about these topics in detail for my recent [Systems Performance 2nd Edition] book.

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A Brief Guide of xPU for AI Accelerators

ACM Sigarch

They introduced the architecture of coarse grain reconfigurable array (CGRA) for statically scheduled data flow computing in HOTCHIPS’17 and its software stack of compiler and linker in ICCAD’17. HPU: Holographic Processing Unit (HPU) is the specific hardware of Microsoft’s Hololens. GPU can also be considered as a special SPU.

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USENIX SREcon APAC 2022: Computing Performance: What's on the Horizon

Brendan Gregg

link] 2021 - [Trader 21] Tiffany Trader, “Cerebras Second-Gen 7nm Wafer Scale Engine Doubles AI Performance Over First-Gen Chip ,” [link] Apr 2021 - [Ghigoff 21] Yoann Ghigoff, et al., "BMC:

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AWS EC2 Virtualization 2017: Introducing Nitro

Brendan Gregg

Hardware virtualization for cloud computing has come a long way, improving performance using technologies such as VT-x, SR-IOV, VT-d, NVMe, and APICv. The latest AWS hypervisor, Nitro, uses everything to provide a new hardware-assisted hypervisor that is easy to use and has near bare-metal performance. I'd expect between 0.1%

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USENIX LISA2021 Computing Performance: On the Horizon

Brendan Gregg

AWS Graviton2); for memory with the arrival of DDR5 and High Bandwidth Memory (HBM) on-processor; for storage including new uses for 3D Xpoint as a 3D NAND accelerator; for networking with the rise of QUIC and eXpress Data Path (XDP); and so on. I also wrote about these topics in detail for my recent [Systems Performance 2nd Edition] book.

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USENIX SREcon APAC 2022: Computing Performance: What's on the Horizon

Brendan Gregg

link] , 2021 [Trader 21] Tiffany Trader, “Cerebras Second-Gen 7nm Wafer Scale Engine Doubles AI Performance Over First-Gen Chip ,” [link] , Apr 2021 [Ghigoff 21] Yoann Ghigoff, et al.,